Fe基非晶合金增强1060铝基多层复合材料的组织与性能

采用累积叠轧焊+中间退火法复合轧制1060Al/Fe基非晶多层铝合金复合板材。利用光学显微镜、扫描电镜、X-衍射分析仪以及拉伸试验机分析Al基复合材料的微观组织结构变化、断口形貌、物相组成以及力学性能。结果表明:Fe基非晶复合材料的增强体在300 ℃中间退火过程中发生部分晶化,在累积变形轧制过程中发生破碎,并随着变形道次的增加,破碎程度随之增大;复合板前6道次的累积轧制变形出现了明显的加工软化现象,并且随着变形道次的增加,其加工软化的效果愈明显;随着累积轧制变形道次增加,Al基复合材料的力学性能发生了明显的变化,第2道次轧制变形后屈服强度与抗拉强度达到了最大值为140 MPa和156 MPa,伸长率为5.53%,达到最佳综合性能。     

Impacts of layout,surface condition and alloying elements on diffusion welding of micro process devices

The formation of a monolithic part during diffusion bonding is accompanied by the diffusion of atoms across the bonding planes. At sufficient low roughness, it mainly depends on the temperature and dwell time. At the same time, the diffusion process competes against grain growth. By adjusting an appropriate level of bearing pressure, it is possible to control deformation taking into account additional parameters resulting from mechanical microstructures and the design and aspect ratio of the part. Furthermore, material properties, such as the content of alloying elements, the degree of cold work hardening and the grain size, have an impact on diffusion and deformation behavior. Also the surface condition of mating surfaces is important to diffusion kinetics and the quality of the joint. Especially passivation layers of corrosion‐resistant alloys, such as stainless steels and nickel‐based alloys, impair diffusion. In contrast to this, cold work hardening at low depth below the surface, e. g. by means of a blasting processes, may facilitate formation of a good bond and help to limit grain size. For oxide dispersion‐strengthened materials, additional impacts on diffusion bonding behavior applies.     

Distributed allocation and dynamic reassignment of channels in UAV networks for wireless coverage

Providing wireless coverage to users using Unmanned Aerial Vehicles (UAVs) encounters two major challenges: deployment and channel allocation. To this end, solutions to both issues are proposed in this paper. An overloaded UAV attempts to acquire more channels by performing channel bonding/aggregation followed by requesting its chosen peers to move closer for load sharing. The proposed channel reallocation schemes minimize interference caused by channel reassignments, or change in network topology. The simulation results show that when employing these schemes, more data is served with reduced discontinuous service time and efficient usage of limited battery power.     

Effects of typical soybean meal type on the properties of soybean-based adhesive

In order to effectively apply soybean meal for the preparation of water-resistant soybean-based adhesives for plywood, the effects of three typical soybean meal products, namely, low-temperature soybean meal (LM), high-temperature soybean meal (HM), and physical soybean meal (PM), on the properties of soybean-based adhesive were investigated. The results indicated that the number of reactive groups in the three soybean meals followed the order LM > HM > PM, which in turn led to various crosslinking densities when these soybean meals were crosslinked by epichlorohydrin-modified polyamide (EMPA) during the curing process. The LM soybean adhesive had 6.6% higher soaking bond strength and 16.5% higher boiling-dry-boiling bond strength than the HM soybean adhesive, and 19% higher soaking bond strength and 33% higher boiling-dry-boiling bond strength than the PM soybean adhesive, respectively. These three soybean meals could be used to prepare soybean adhesives for interior-use plywood because all plywood panels bonded with their adhesives passed a water-soaking test at 63 °C for 3 h, but only the LM soybean adhesive achieved the desired water resistance for floor-base plywood. Among the three evaluated soybean meals, LM was the most promising raw material for the preparation of soybean-based adhesive because of a greater number of reactive groups, higher crosslinking density, and superior bond strength. Plywood panel bonded with HM soybean adhesive had a water resistance lower than, but very close to, the standard required value (>0.8 MPa) for floor-base plywood.     

Digital image correlation strain measurement of thick adherend shear test specimen joined with an epoxy film adhesive

Structural bonding and bonded repairs of composite materials become more and more important. Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used. However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.     

Chemical Bonding by the Chemical Orthogonal Space of Reactivity

The fashionable Parr–Pearson (PP) atoms-in-molecule/bonding (AIM/AIB) approach for determining the exchanged charge necessary for acquiring an equalized electronegativity within a chemical bond is refined and generalized here by introducing the concepts of chemical power within the chemical orthogonal space (COS) in terms of electronegativity and chemical hardness. Electronegativity and chemical hardness are conceptually orthogonal, since there are opposite tendencies in bonding, i.e., reactivity vs. stability or the HOMO-LUMO middy level vs. the HOMO-LUMO interval (gap). Thus, atoms-in-molecule/bond electronegativity and chemical hardness are provided for in orthogonal space (COS), along with a generalized analytical expression of the exchanged electrons in bonding. Moreover, the present formalism surpasses the earlier Parr–Pearson limitation to the context of hetero-bonding molecules so as to also include the important case of covalent homo-bonding. The connections of the present COS analysis with PP formalism is analytically revealed, while a numerical illustration regarding the patterning and fragmentation of chemical benchmarking bondings is also presented and fundamental open questions are critically discussed.     

New insights into microstructural changes during transient liquid phase bonding of GTD-111 superalloy

The effects of joining temperature (T_J) and time (t_J) on microstructure of the transient liquid phase (TLP) bonding of GTD-111 superalloy were investigated. The bonding process was applied using BNi-3 filler at temperatures of 1080, 1120, and 1160 °C for isothermal solidification time of 195, 135, and 90 min, respectively. Homogenization heat treatment was also applied to all of the joints. The results show that intermetallic and eutectic compounds such as Ni-rich borides, Ni−B−Si ternary compound and eutectic-γ continuously are formed in the joint region during cooling. By increasing t_J, intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well. With the increase of the holding time at all of the three bonding temperatures, the thickness of the athermally solidified zone (ASZ) and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone (DAZ) increases. Similar results are also obtained by increasing T_J from 1080 to 1160 °C at t_J=90 min. Furthermore, increasing the T_J from 1080 to 1160 °C leads to the faster elimination of intermetallic phases from the ASZ. However, these phases are again observed in the joint region at 1180 °C. It is observed that by increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. Based on these results, increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.     

Development of silicon wafer packaging technology for deep UV LED

This paper reports a deep‐ultraviolet LED (deep‐UV‐LED) package based on silicon MEMS process technology (Si‐PKG). The package consists of a cavity formed by silicon crystalline anisotropic etching, through‐silicon vias (TSVs) filled with electroplated Cu, bonding metals made of electroplated Ni/AuSn and a quartz lid for hermetic sealing. A deep‐UV LED die is directly mounted in the Si‐PKG by AuSn eutectic bonding without a submount. It has advantages in terms of size, heat dissipation, light utilization efficiency, productivity and cost over conventional AlN ceramic packages. We confirmed a light output of 30 mW and effective reflection on Si (111) cavity slopes in the Si‐PKG. Based on simulation, further improvement of the optical output is expected by optimizing DUV‐LED die mount condition.     

InSb红外探测器芯片粘接工艺研究

基于InSb红外探测器的封装特点,采用正交试验法研究了芯片粘接过程中基板平整度、粘接剂抽真空时间、配胶时间、固化条件等工艺参数对芯片性能及可靠性的影响。通过计算极差和方差分析了各因素对芯片可靠性的影响大小。结果表明,固化条件对粘接后芯片的性能影响最大,其次是配胶时间,而抽真空时间和基板平整度影响相对较小。针对极差分析得出的较优参数组合和较差参数组合,利用X射线衍射(XRD)研究了不同参数组合对晶片粘接的应力大小,所得结果与正交试验一致。     

A new cladding technology to bond aluminium on magnesium

ABSTRACT

An in situ hot press bonding technology has been developed to clad aluminium on magnesium. Followed by regular hot rolling, magnesium sheets, covered by ductile and corrosion-resistant aluminium without detectable oxides in the interface, are produced. The new technology requires no welding, vacuum, protective atmosphere or barrier layer, and it makes good interfacial strength and rollability. Aluminium–magnesium intermetallic phases are formed along the clad–core interface at elevated temperatures. They are not detrimental under compression but may cause clad-core delamination in tensile strain. However, the tensile failure is more dependent on the formability of magnesium core than on the strength of interface.